图片仅供参考,产品以实物为准
| 规格书 |
 |
| 类型 | Backplane |
| 间距 | 2 mm |
| 行数 | 4 |
| 触点数 | 72 |
| 端接方式 | Press Fit |
| 安装 | Through Hole |
| 触点电镀 | Gold |
| 标准包装 | Bulk |
| 评论 | With Guides; With sequenced contacts. Refer to customer drawing for specific lo |
| Lead Free Solder Processes | Not relevant for lead free process |
| 压入后风格 | Compliant Pin |
| PCB安装角度 | Vertical |
| 模块类型 | Signal |
| 触点区域镀层材料 | Gold (30) |
| 测序配置B行 | Mating Post Length 5.75mm, Termination Post Length 4.25mm, Mating Post Length 5 |
| 测序配置行答 | Mating Post Length 5mm, Termination Post Length 4.25mm, Mating Post Length 7.25 |
| 外壳材料 | Liquid Crystal Polymer (LCP) |
| 测序配置行C | Mating Post Length 5mm, Termination Post Length 4.25mm, Mating Post Length 7.25 |
| 发表类型 | Press-Fit |
| RoHSELV合规性 | Not ELV/RoHS compliant |
| 测序配置D排 | Mating Post Length 5.75mm, Termination Post Length 4.25mm, Mating Post Length 5 |
| 发表电镀 | Tin |
| 排序 | Yes |
| 中心线矩阵（毫米（ ） ） | 2.00 x 2.00 [.079 x .079] |
| 产品类型 | Fixed-Board (Header) |
| 信号位置数 | 72 |
| 额定电压（VAC ） | 30 |
| 触点材料 | Phosphor Bronze |
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